Fujitsu claims that by 2017 we should see water cooling come to smartphones






We’ve all heard of water cooled PC’s and probably have built a computer system with this kind of technology, but what Fujitsu is proposing is totally insane!

They claim that by 2017 they will develop the worlds first liquid water cooling system geared towards smartphones and possibly tablets, the technology appears to be based on a heat-sink (pipes) that would transfer liquid/vapor to cool our devices.

Here is how the water cooling system from Fujitsu would work:

A loop heat pipe is a heat-transfer device that consists of an evaporator that absorbs heat from the heat source and a condenser that dissipates that heat away, with the two components connected by pipes into a loop (Figure 1). A working fluid is encapsulated inside this closed loop as a coolant. The heat from the heat source evaporates the coolant, and the energy that goes into evaporating the coolant is taken away from the heat source, lowering its temperature. It is based off of the same principle used when sprinkling water on pavement to reduce heat.

Heat transfer using a loop heat pipe is based on the same sort of capillary action that absorbs water in fibers, sponges, and plants. The evaporator contains a porous structure, with the numerous holes driving the fluid with capillary action. To achieve this action, Fujitsu stacked together copper sheets to develop a structure containing minuscule pores. The pattern of holes etched into the sheets is such that the holes of each layer are slightly offset from the adjacent layers. When these sheets are stacked, capillary action is created that causes the fluid to circulate. In addition, by separating the vapor phase and liquid phase, there are two flows of the working fluid within the stacked structure, which enables efficient heat transfer. Furthermore, because the liquid line that returns fluid to the evaporator operates on capillary action, enabling it to stably transfer heat regardless of the device’s orientation, this technology can now be applied to mobile devices.

This loop heat pipe uses copper sheets that are only 0.1 mm thick, with two surface sheets and four inner-layer sheets, for a total of six sheets. The previous, approximately 10 mm thick evaporator of the loop heat pipe can now be reduced to 0.6 mm, enabling a heat-transfer device to be equipped to compact mobile devices.

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